1366 Technologies raises $18 million and targets to drive costs below $0.15 per wafer piece

US silicon wafer manufacturer 1366 Technologies Inc. announced an $18 million Series E financing from several new investors including Breakthrough Energy Ventures. Return investors also joined the round. The company will use the funding to realize Direct Wafer furnaces capable of producing multiple wafers at a time within an even smaller footprint, driving the cost below $0.15 per wafer piece.
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